Corfin Industries provides component preparation services to defense, medical, telecommunications, and other high reliability industries. We pioneered our core technology, Robotic Hot Solder Dip, in the 1980’s and today serve major OEMs and their subcontractors around the world. Corfin Industries has earned an unmatched reputation for quality and dependability resulting in preferred supplier status for numerous defense programs. Corfin facilities are ISO 9001 and AS9100 registered and JPL-certified for less than 50 volts of ESD potential at any work station.

 

Component Preparation

 

Robotic Hot Solder Dip (RHSD)

 

Tin Whisker Mitigation - US Navy-qualified process removes 100% of the pure tin and replaces it with SnPb (tin-lead).

 

Gold Mitigation - Removes gold and replaces it with SnPb. Typically required to cover the effective seating plane.

 

RoHS Compliance - Removes the SnPb and replaces it with SAC305 (tin silver copper) or any other specified alloy.

 

Modification and Repair

 

BGA Reballing for Conversion to Tin-Lead or RoHS-Compliance - Flushes all balls and alloy residue on the pads and replaces balls of Sn63Pb37, SAC305, or any other specified alloy.

 

Trim and Form - Forms and trims straight leads for surface mount placement per the customer’s drawing or Corfin Industries can propose a drawing. An RHSD process typically follows this process to coat leads and prevent oxidization.

 

Re-Conditioning of Bent Leads - Robotic process realigns leads that are bent and scans to verify results.

 

Lead-Attach to Leadless Chip Carriers - Reduce solder joint stress by attaching J-shape and L-shape leads to LCC’s using thermocompression bonding.

 

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